Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.

Quantum engineers have spent years trying to tame the fragility of qubits, only to be thwarted by the tiniest imperfections in the materials they use. Now a new line of research flips that problem on ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...