The highly integrated MxL93542, Telluride PAM4 DSP, offers superior overall performance and power consumption in a small QSFP-DD form factor CARLSBAD, Calif.--(BUSINESS WIRE)-- MaxLinear, Inc. (NYSE: ...

Monolithic 3nm 1.6T (8:4) PAM-4 DSP with integrated laser driver Delivers best-in-class module performance in BER and power consumption Proven interoperability with Broadcom’s 400G EML and PD ...

The MxL93542 400G PAM4 DSP allows companies like uSenlight to develop a 400Gbps optical interconnect module in a compact form factor for intra-datacenter applications with a transmission distance up ...

SINGAPORE--(BUSINESS WIRE)--Rain Tree Photonics Pte. Ltd. (RTP), a silicon photonics chip maker for hyperscale data-centers and 5G today announced the availability of a silicon photonics-based ...

PALO ALTO, Calif., March 11, 2026 (GLOBE NEWSWIRE)-- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, ...

3nm 400G/lane technology enables best-in-class 1.6T transceivers and lays the foundation for 204.8T networks using 3.2T transceivers PALO ALTO, Calif., March 11, 2026 (GLOBE NEWSWIRE)-- Broadcom Inc. ...

PALO ALTO, Calif., March 11, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, ...

PALO ALTO, Calif., March 11, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, ...

Backend house ShunSin Technology, a subsidiary of Foxconn Technology (Hon Hai Precision) specializing in system-in-package (SiP) modules, is poised to reap handsome income by rendering packaging ...